For Gold Wire Corner Seal Flange

New Wire Bondable Gold Thick Film Conductors For LTCC Applications

Low temperature co-fired ceramic (LTCC) with silver and gold conductor systems offer a low cost, high performance, and high reliability solution utilizing the advantages of ceramic technology. Gold conductors are generally used in applications requiring best reliability in harsh environmental conditions. Gold conductors are bonded to active or passive components through wirebonding, soldering, ...

Digital Control of Bonding Force for Gold Wire Bonding Machine

In order to digitally control the bonding force of a wire bonder precisely, this paper uses a DC solenoid as a force source, and by controlling the solenoid’s current, which causes the electromagnetic force, we can control the bonding force that capillary applies. The bonding force control system in this paper is composed of PC (Personal Computer) and hypogyny MCU (Micro Controller Unit), which...

The UNESCO Seal of Excellence for Handicrafts

The UNESCO Seal of Excellence for Handicrafts

Thermosonic Gold Wire Bonding to Palladium Finishes on Laminate Substrates

As the laminate substrate industry moves from Hot Air Solder Level (HASL) finishes, alternate plating finishes are being proposed such as immersion gold/electroless nickel, electroless palladium and electroless silver. This paper presents results of an evaluation of the thermosonic gold ball wire bondability of electroless palladium. Two palladium thicknesses, with and without a nickel underlay...